Electronics and Sensors

This issue of Microelectronics TOE covers advances in silicon photonics technology for data center applications. Innovations profiled include high-speed silicon photonics-based interconnects by Mellanox Technologies, silicon photonics optical transceivers for long range data transmission by Intel Corporation, a scalable non-blocking silicon photoni...

This issue of Microelectronics TOE covers innovations in millimeter wave technology for communication. Developments profiled include a wireless virtual reality headset that uses millimeter wave technology, demonstration of long range capability in rural applications, sharing of spectrum for 5G communication, and a millimeter wave network technology...

This issue of Microelectronics TOE covers advances in structural electronics. Structural electronics integrates electronic devices, sensors, electrical components, and photonic devices that enable structural components in assemblies to have advanced functional value. Innovations profiled in this issue include a water mapping technique in concrete s...

Traditional forms of vending have relied on limited interactions between consumers and machines. Vending, in principle, is a retail operation that requires minimal human intervention and the machines should be as autonomous as possible. The connectivity afforded by the Internet of Things (IoT) will enable a fully autonomous vending operation and it...

08 Nov 2016  |  Asia Pacific

Strategic Analysis of the Printed Electronics Market in Southeast Asia

The Market is Moving from Prototype to Mass Commercialization and will Generate Over $1 Billion by 2020

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This study provides an understanding of the printed electronics market in Southeast Asia. It analyses the factors impacting the market and the major companies operating in the domain. It also provides a product-wise break-up and discusses key end users and compares competitors.

This issue of Microelectronics TOE covers recent developments in brain-computer interface (BCI) technologies for healthcare applications. Innovations profiled include BCI enabling sense of touch for disabled by the University of Chicago Medicine, speech recognition from neural networks by the University of Bremen, a bi-directional BCI providing sen...

This issue of Microelectronics TOE covers recent advances in microfluidic technology and provides insights on patents, applications impacted, market landscape, growth factors, and adoption barriers. Innovations profiled include a fabrication process for a polymer-based integrated microfluidic chip by Epigem, a bonding technology at room temperature...

This issue of Microelectronics TOE covers advancements in holographic display technology. Key innovations profiled include a interactive holographic display by Provision Interactive Technologies, an integrated holographic system for medical imaging by EchoPixel, LEIA's holographic technique, and a holographic flexible smartphone by the Queen's Univ...

This issue of Microelectronics TOE covers advances in photonic integrated circuits (PICs). Innovations profiled include a microlenses-based hybrid integration technology by Kaiam Corporation, a CMOS technology enabled PIC Interconnect by Luxtera Inc., a monolithically integrated Indium phosphide-based PIC transceiver by OneChip Photonics Inc., and ...