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3D IC Technology--An Assessment (Technical Insights)
3D IC Technology--An Assessment (Technical Insights)
RELEASE DATE
30-Sep-2008
30-Sep-2008
REGION
North America
North America
Deliverable Type
Technology Research
Technology Research
Research Code: D14C-01-00-00-00
SKU: ES00452-GL-TR_15780
$4,950.00
In stock
SKU
ES00452-GL-TR_15780
Description
The research service discusses global trends 3D IC technology. It discusses in detail, development and adoption trends of 3D IC technology focusing on various aspects of the technology across the value chain. It further highlights the new developments in this sector.
Table of Contents
Scope and Methodology
- Scope
- Methodology
Research Overview & Key Research Findings
- Research Overview
- Key Research Findings
Technology Primer and Applications Scenario
3D IC Technology Performance Evaluation
- Dominant Packaging Platforms
- 3D IC--An Industry Outlook
- Application Scenario
Silicon on Insulator--A Key Substrate Technology
Interconnects and Bonding Technologies
3D IC Design Technologies
- Wafer Technologies--An Outlook
- SOI--A Key Substrate Enabler to 3D IC
Industrial Growth Patterns
Growth Opportunity Analysis
Packaging Technologies and Application Specific Solutions
Interconnect and Bonding
Patents in 3D Packaging
Key Contacts
Decision Support Database Tables
Popular Topics
The research service discusses global trends 3D IC technology. It discusses in detail, development and adoption trends of 3D IC technology focusing on various aspects of the technology across the value chain. It further highlights the new developments in this sector.
| Deliverable Types | Technology Research |
|---|---|
| No Index | Yes |
| Podcast | No |
| Industries | Electronics and Sensors |
| WIP Number | D14C-01-00-00-00 |
| Is Prebook | No |