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Innovations in Semiconductor Materials

Innovations in Semiconductor Materials

RELEASE DATE
10-Feb-2017
REGION
Global
Deliverable Type
Technology Alert
Research Code: D737-00-44-00-00
SKU: ES00918-GL-TA_19599
$250.00
In stock
SKU
ES00918-GL-TA_19599
$250.00
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Description

Internet of Things (IoT) is driving a global transformation in fields such as communication, entertainment, and industrial manufacturing based on highly differentiated electronic devices that can perform complex tasks to simplify decision making process. The trend that once existed in the semiconductor industry according to Moore’s Law is no longer relevant in current day scenario as the rate of miniaturization has compelled semiconductor manufacturers to bring down the size of silicon chip to less than 10 nm. In order to meet this challenge, major companies including IBM have focused on how material development can aid in reducing the size of transistors. The key focus area for researchers is to find out how the size of the transistor (including its contacts and channels) can be reduced without compromising on performance. Frost & Sullivan has been tracking this space and we have identified key stakeholders in material development, who are working to identify new materials such as carbon nanotube chips, graphene nanowires, and black phosphorus among others as effective replacements for silicon.

In this issue of High Tech Materials TOE, key research outputs from stakeholders across the value chain, key partnerships that are driving change, and strategic focus of top participants in the semiconductor industry that is expected to change the landscape of electronics and computing, are profiled.

The High-Tech Materials TechVision Opportunity Engine (TOE) provides intelligence on technologies, products, processes, applications, and strategic insights on various materials across industries. Some material technologies include lightweight materials, bio–based materials, ceramics, smart materials, fibers, nanomaterials, responsive materials, polymers, woven and non woven materials, polymers and plastics and packaging materials.

The Chemicals and Advanced Materials cluster tracks research and innovation trends and developments across specialty chemicals, plastics, polymers, chemicals, bio-chemicals, metals, coatings, thinfilms, surface treatments, composites, alloys, oil and gas, fuel additives, fibers, and several other related technologies and its impact and application across industries.

Miniaturization, a move toward lower power consumption, and the need for enhanced features are driving innovations in the electronics sector. Technology focus areas include semiconductor manufacturing and design, flexible electronics, 3D integration/IC, MEMS and NEMS, solid state lighting, advanced displays, nanoelectronics, wearable electronics, brain computer interface, advanced displays, near field communication, and next generation data storage or memory.

Keywords: Carbon nanotubes, graphene, black phosphorus, semiconductor material, consumer electronics, Internet of Things, transistor, chip fabrication

Table of Contents

Material Innovations Driving Semiconductor Chip Miniaturization

  • Beta Gallium Oxide Offers New Possibilities in Ultra-efficient Switches
  • Semiconductor Nanowires Using Graphene as a Replacement for Silicon
  • Novel Material for Use in High-power, Low-energy Oxide Electronics
  • Black Phosphorus Crystal-based Transistor

Strategic Insights

  • Consumer Electronics is the Key Application Focus Area
  • Quest for Silicon Replacement Driven by Chip Miniaturization

Key Patents

  • Carbon Nanotubes and Graphene are Key Materials of Interest with IBM, Sony among Top Applicants

Industry Contacts

  • Key Contacts
Internet of Things (IoT) is driving a global transformation in fields such as communication, entertainment, and industrial manufacturing based on highly differentiated electronic devices that can perform complex tasks to simplify decision making process. The trend that once existed in the semiconductor industry according to Moore’s Law is no longer relevant in current day scenario as the rate of miniaturization has compelled semiconductor manufacturers to bring down the size of silicon chip to less than 10 nm. In order to meet this challenge, major companies including IBM have focused on how material development can aid in reducing the size of transistors. The key focus area for researchers is to find out how the size of the transistor (including its contacts and channels) can be reduced without compromising on performance. Frost & Sullivan has been tracking this space and we have identified key stakeholders in material development, who are working to identify new materials such as carbon nanotube chips, graphene nanowires, and black phosphorus among others as effective replacements for silicon. In this issue of High Tech Materials TOE, key research outputs from stakeholders across the value chain, key partnerships that are driving change, and strategic focus of top participants in the semiconductor industry that is expected to change the landscape of electronics and computing, are profiled. The High-Tech Materials TechVision Opportunity Engine (TOE) provides intelligence on technologies, products, processes, applications, and strategic insights on various materials across industries. Some material technologies include lightweight materials, bio–based materials, ceramics, smart materials, fibers, nanomaterials, responsive materials, polymers, woven and non woven materials, polymers and plastics and packaging materials. The Chemicals and Advanced Materials cluster tracks research and innovation trends and developments across specialty chemicals, plastics, polyme
More Information
Deliverable Types Technology Alert
No Index No
Podcast No
WIP Number D737-00-44-00-00
Is Prebook No
Ti Codes D737