Description

This issue of Microelectronics TOE covers recent advances in microfluidic technology and provides insights on patents, applications impacted, market landscape, growth factors, and adoption barriers. Innovations profiled include a fabrication process for a polymer-based integrated microfluidic chip by Epigem, a bonding technology at room temperature by Invenios, an air bubble-based microfluidic system by the RMIT University, and a microfluidic system-based smart wearable by Dublin City University.

The Microelectronics TechVision Opportunity Engine (TOE) captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs).

Miniaturization, a move toward lower power consumption, and the need for enhanced features are driving innovations in the electronics sector. Technology focus areas include semiconductor manufacturing and design, flexible electronics, 3D integration/IC, MEMS and NEMS, solid state lighting, advanced displays, nanoelectronics, wearable electronics, brain computer interface, advanced displays, near field communication, and next generation data storage or memory.

Keywords: Microfluidic chip, smart wearables, polymers